Clear FilterPurpose of Position Establishment
To develop, optimize, and sustain high-precision pick-and-place and reconstruction processes for glass optics modules and silicon dies used in advanced photonics and semiconductor packaging. This role ensures robust process integration, high yield, and alignment accuracy to meet stringent optical and electrical performance requirements for next-generation devices.
Job Responsibilities
1.Process Development and Optimization
1.1 Design and implement precision pick-and-place processes for glass optics and silicon dies using automated equipment (e.g., die bonders, flip-chip tools, vision systems).
1.2 Develop reconstruction processes including die reconstitution, wafer-level packaging, and optical alignment.
1.3 Design die sort methodologies including wafer mapping, binning strategies, and defect classification.
1.4 Evaluate and select adhesives, bonding materials, and curing profiles suitable for optical and semiconductor integration.
1.5 Conduct Design of Experiments (DOE) to optimize process parameters for yield, throughput, and reliability.
2.Equipment and Tooling
2.1 Specify and qualify equipment for pick-and-place and reconstruction operations.
2.2 Collaborate with equipment vendors to customize tooling and vision algorithms for sub-micron alignment.
2.3 Maintain and improve equipment uptime and process stability through preventive maintenance and troubleshooting.
3.Metrology and Quality Control
3.1 Define and implement metrology strategies for placement accuracy, tilt, coplanarity, and bonding quality.
3.2 Work with optical and electrical test teams to correlate process parameters with device performance.
3.3 Develop inspection criteria and control plans to ensure consistent quality across production lots.
4.Cross-Functional Collaboration
4.1 Work closely with optics design, packaging, and reliability teams to ensure process compatibility with product requirements.
4.2 Support new product introduction and transfer of processes from R&D to mass production.
4.3 Provide technical guidance to manufacturing and operations teams during ramp-up and sustaining phases.
5. Documentation and Reporting
5.1 Create and maintain detailed process documentation including SOPs, FMEAs, control plans, and work instructions.
5.2 Analyze process data and present findings to stakeholders for continuous improvement initiatives.
Qualifications
Basic Requirements
Bachelor’s or master’s degree in mechanical engineering, Materials Science, Optoelectronics, or related field.
Work Experience
1. 5+ years of hands-on experience in pick-and-place and reconstruction processes, preferably in optics or semiconductor packaging.
2. Proficiency in handling glass optics, silicon dies, and wafer-level packaging ,cutting process?technologies.
Knowledge and Preferred Skills
1. Strong understanding of adhesive bonding, thermal curing, and alignment systems (Datacon, Mühlbauer).
2. Experience with statistical process control (SPC), DOE, and failure analysis.
3. Familiarity with cleanroom practices and wafer handling protocols.
4. Strong problem-solving and communication skills.
5. Proficiency in statistical analysis tools (e.g., JMP, Minitab) and process control methodologies.
Professional Qualities
Strong teamwork spirit, sense of responsibility, result-oriented mindset, and practical work ethic.
