Core Technologies
Diode Lasers
Eutectic Bonding
Thermal Management
Thermal Stress
Control
Interface Materials and Surface Engineering
Eutectic Bonding
Precise control of laser diode chip bonding parameters enables void-free and defect-free die attachment, significantly enhancing thermal conductivity, reducing thermal stress, and thus improving the products’ performance and lifetime.
Thermal Management
Optimizing design in packaging structure and using advanced material with high thermal conductivity effectively improve the ability of heat dissipation to ensure a higher output power.
Thermal Stress
Control
Theoretical study and analysis of the mechanism of thermal stress on the performance of high-power diode lasers enable us to develop the advanced thermal management technology which can lower and homogenize the thermal stress, and improve the device performance, e.g., lower smile, higher degree of polarization (DoP) and narrower spectrum.
Interface Materials and Surface Engineering
Surface treatment techniques greatly improve wettability and bonding strength of packaging materials, enhancing long-term reliability. An in-house developed gold-tin eutectic alloy film process further makes the bonding stable and indium-free.
Beam Shaping
Beam Transformation
Beam Homogenization
Line Beam Shaping
Beam Transformation
Our Beam Transformation System (BTS) transforms the asymmetrical far-field distribution of a diode laser bar into a nearly symmetrical beam parameter product.
Beam Homogenization
Focuslight homogenizers can produce many different beam shapes, making them extremely versatile in use.
Line Beam Shaping
Shaping and conversion of up to 12 symmetrical laser beams (e.g. Gaussian profile) into an ultra-uniform high-energy-density line beam. Our 750 mm UV-Line system has been used in the most advanced flexible OLED production line in the world, with uniformity of over 97%.
Optics Manufacturing
Wafer-Level Optics (WLO) Precision Imprinting
Wafer-Level Stacking (WLS)
Wafer-Level Simultaneously Structured Laser Optics Manufacturing
Photolithography-RIE (reactive ion etching) for Wafer-Level Precision Optics Manufacturing
Wafer-Level Optics (WLO) Precision Imprinting
With master molds are designed and fabricated based on micro-nano optical design requirements, high-precision imprinting is performed on 6" or 8" polymer-on-glass (POG) wafers using a scalable wafer-level process suitable for large-volume production. The UV-curing and processes conducted under low temperature and low pressure enable high-fidelity replication of micro- and nano-scale features with excellent structural conformity.
Wafer-Level Stacking (WLS)
Using advanced mask alignment systems, multiple optical wafers and rigid spacers are aligned and stacked with micron-level accuracy. This process enables highly compact, barrel-free, and reflowable optical lens modules with high integration density, which can further incorporate additional functionalities such as apertures, optical coatings, and spectral filters, offering cost-effective and scalable module solutions.
Wafer-Level Simultaneously Structured Laser Optics Manufacturing
A proprietary laser-based process that enables high-precision, high-repeatability production of optical components at large scale and low cost. It can prepare 12-inch (300mm×300mm) glass micro-optics wafers and refractive micro-lens elements (ROE).
Photolithography-RIE (reactive ion etching) for Wafer-Level Precision Optics Manufacturing
A precise micro and nano-optical manufacturing technique for optics components based on silicon and fused silica. Utilizes photolithography and reactive ion etching (RIE) to achieve accurate shaping, sizing, and positioning. Enables batch manufacturing of high-precision micro and nano-optical structures on wafers up to 8 inches in size.
Test Analysis and Diagnosis
Test Analysis and
Diagnosis
Test Analysis and
Diagnosis
A comprehensive physical diagnostic model allows full characterization of high-power diode laser parameters, including LIV curves, spectra, polarization, far/near fields, spatial spectra/polarization, spatial beam profiles, Smile effect, and lifetime. Wave optics models are used in conjunction with tactile surface measurements for precise analysis of optical functions such as focusing, collimation quality, and beam uniformity.
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